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Call for Papers (Flyer)

IECC will present the most recent and exciting advances in Electronics Communication through keynote talks. Prospective authors are invited to submit papers on relevant topics, but not limited to:

1. Next-Generation Wireless Communications

  • Reconfigurable Intelligent Surfaces (RIS): programmable wireless environments, channel modeling, phase shift control, and RIS-aided transmission
  • Terahertz Communications: devices, antennas, beamforming, channel characterization, and system integration for 6G
  • Integrated Sensing and Communications (ISAC): joint waveform design, sensing-assisted communication, resource allocation, and performance trade-offs
  • Cell-Free Massive MIMO: architecture, distributed signal processing, fronthaul design, and user-centric clustering
  • Semantic and Goal-Oriented Communications: beyond bit transmission, semantic encoding, task-driven compression, and AI-native protocols
  • Millimeter-wave and Sub-THz systems: propagation modeling, beam management, and hardware impairments

2. Optical Communications and Fiber Networks

  • Space Division Multiplexing: few-mode and multi-core fiber transmission, mode coupling, MIMO-DSP, and spatial channel modeling
  • Coherent Optical Communications: advanced modulation formats, digital signal processing for short-reach and long-haul applications
  • Optical Network Automation: AI/ML-based control, fault prediction, self-optimizing networks, and telemetry
  • Underwater Wireless Optical Communication: channel modeling (turbulence, scattering), link budget, and system design for blue-green wavelengths
  • Elastic Optical Networks: spectrum slicing, dynamic resource allocation, fragmentation management, and SDN-enabled control
  • Free-space optical (FSO) communications: atmospheric turbulence mitigation, acquisition/tracking, and hybrid RF/FSO systems

3. Structured Light and Optical Field Manipulation

  • Orbital Angular Momentum (OAM): generation, multiplexing, demultiplexing, and detection for high-capacity communications
  • Metasurface Wavefront Engineering: compact beam shaping devices, holographic metasurfaces, and programmable metasurfaces
  • Vector Beams and Polarization Control: spatially variant polarization, Poincaré sphere encoding, and applications in communication systems
  • Non-Diffracting Beams: Bessel, Airy, and Mathieu beams: propagation properties and beam recovery in free-space links
  • Propagation of Structured Light in Turbulent Media: adaptive compensation, turbulence-resistant encoding, and channel correction techniques
  • Plasmonic and dielectric nano-antennas for beam steering

4. Optical Sensing: Technologies and Applications

  • Distributed Fiber Optic Sensing: Brillouin, Raman, and Rayleigh scattering techniques for temperature, strain, and vibration monitoring
  • Fiber Bragg Grating (FBG) Sensors: design, multiplexing, and structural health monitoring
  • LiDAR Technologies: solid-state LiDAR, FMCW LiDAR, photon-counting LiDAR for autonomous driving and 3D mapping
  • Photonics Integrated Chip Sensors: on-chip optical sensors for chemical, biological, and physical quantities
  • Surface Plasmon Resonance (SPR) Sensors: real-time label-free detection, biosensing arrays, and portable platforms
  • Optical coherence tomography (OCT) and interferometric sensing

5. Machine Learning and AI in Communications

  • Deep Learning for Physical Layer: channel estimation, equalization, demodulation, and end-to-end learning for transceivers
  • Federated Learning for Edge Communications: privacy-preserving distributed training, model aggregation, and resource-aware learning
  • Graph Neural Networks for Network Routing: topology-aware optimization, flow scheduling, and adaptive routing
  • Generative AI for Network Management: traffic prediction, anomaly detection, and network digital twins
  • Autoencoder-Based End-to-End Communication: joint source-channel coding, learned modulation, and robust representations
  • Reinforcement learning for resource allocation: dynamic spectrum access, power control, and beam selection

6. Communication Signal Processing

  • Advanced Modulation and Coding: OFDM, FBMC, UFMC, LDPC, polar codes, and turbo equalization
  • Adaptive Filtering and Equalization: blind equalization, decision feedback equalizers, and Kalman filtering for time-varying channels
  • MIMO Signal Processing: precoding, detection algorithms (ZF, MMSE, sphere decoding), and massive MIMO reduced-complexity methods
  • Array Signal Processing: DOA estimation (MUSIC, ESPRIT, compressive sensing), beamforming (adaptive, robust), and source localization
  • Nonlinear Distortion Compensation: digital predistortion, memory polynomial models, and neural-network-based linearization
  • Signal Processing for Software-Defined Radio: reconfigurable filter banks, sample-rate conversion, and digital up/down conversion
  • Compressed Sensing and Sparse Recovery for channel estimation and spectrum sensing
  • Real-time DSP implementations on FPGA, GPU, and multi-core architectures

7. Electromagnetic Theory and Technologies

  • Computational Electromagnetics: FDTD, FEM, MoM, integral equation methods for antenna and scattering problems
  • RF/Microwave Circuits and Systems: LNA, mixer, VCO, power amplifiers, filters, and passive components (couplers, dividers)
  • Antenna Theory and Design: phased arrays, reflectarrays, lens antennas, MIMO antennas, and millimeter-wave antenna-in-package
  • Electromagnetic Compatibility and Interference (EMC/EMI): shielding, grounding, crosstalk mitigation, and system-level modeling
  • Metamaterials and Metasurfaces: negative-index materials, cloaking, perfect absorbers, and tunable electromagnetic surfaces
  • Millimeter-wave and Terahertz Electromagnetics: propagation, scattering, and material characterization
  • High-Power Electromagnetic (HPEM) Effects and protection techniques
  • Electromagnetic Inverse Problems for imaging and non-destructive testing

8. Advanced Microelectronic Systems and Components

  • RF MEMS and Tunable Components: switches, varactors, resonators, and phase shifters for reconfigurable front-ends
  • Monolithic Microwave Integrated Circuits (MMIC) for communication transceivers (GaN, GaAs, SiGe)
  • System-in-Package (SiP) and Heterogeneous Integration: 3D integration, interposers, and chiplet-based RF modules
  • High-Speed Mixed-Signal Circuits: data converters (ADC/DAC) for wideband communication, jitter analysis, and calibration
  • Power Amplifier Efficiency Enhancement Techniques: Doherty, envelope tracking, outphasing, and digital predistortion
  • Frequency Synthesizers and Clocking: PLLs, DDS, fractional-N synthesizers for mm-wave and sub-THz bands
  • Antenna-in-Package (AiP) and Module Design for 5G/6G terminals and base stations
  • Reliability and Thermal Management of microsystems for communication infrastructure

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